Title:
CONDUCTIVE PASTE, AND PRINTED WIRING BOARD USING IT
Document Type and Number:
Japanese Patent JP2007227156
Kind Code:
A
Abstract:
To provide conductive paste excelling in a migration suppression effect and in conductivity; and to provide a printed wiring board using it.
This conductive paste contains a conductive filler and a binder resin as essential constituents. The conductive paste is characterized in that the conductive filler contains silver powder and silver-coated copper powder as main constituents, and the content of the silver-coated copper powder is 1-40 wt.% of the whole conductive filler. This printed wiring board is characterized by printing the conductive paste on a board.
COPYRIGHT: (C)2007,JPO&INPIT
Inventors:
OKA YOSHIO
YAGI SHIGETO
YAGI SHIGETO
Application Number:
JP2006046967A
Publication Date:
September 06, 2007
Filing Date:
February 23, 2006
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01B1/22; B22F1/00; B22F1/02; H05K3/12; H01B1/00
Domestic Patent References:
| JP2003068139A | 2003-03-07 | |||
| JP2005032471A | 2005-02-03 | |||
| JP2005294254A | 2005-10-20 | |||
| JP2001351436A | 2001-12-21 |
Attorney, Agent or Firm:
Minoru Nakano
Mikio Yamaguchi
Hideaki Nishima
Mikio Yamaguchi
Hideaki Nishima
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