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Patent Searching and Data


Title:
CONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JP2000173344
Kind Code:
A
Abstract:

To improve a speedy hardening characteristic, adhering characteristic and a moisture resistant characteristic by essentially containing a resin ingradient, sulfonium salt and conductive powder containing glycildylester and fat ring type epoxy resin and Allyl-nadic-imide compound.

Glycidylester is represented by a formula I, where R is a two valent or more organic group, n is an integer of 0-15, m is an integer of 2-4. Allyl-nadic-imide compound is represented by a formula II, where R is two valent or more organic group. Sulfonium salt is represented by a formula III or IV, where X is CH3, H, halogen atom or No2, M is Sb, As or P. In the formula IV, R is alkyl group, halogen atom or H, R3 is alkyl group or acyl group, A is SbF6, AsF6, PF6 or CH3SO4.


Inventors:
ONISHI TATSUYA
Application Number:
JP34812898A
Publication Date:
June 23, 2000
Filing Date:
December 08, 1998
Export Citation:
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Assignee:
TOSHIBA CHEM CORP
International Classes:
H01B1/20; C08G59/20; C09J163/00; (IPC1-7): H01B1/20; C08G59/20; C09J163/00
Attorney, Agent or Firm:
Eiji Morota