Title:
CONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JP2002140932
Kind Code:
A
Abstract:
To provide conductive paste used for mounting a semiconductor chip or the like, having a low stress property while exerting heat resistance reliability, that is a characteristic of a conventional epoxy resin.
This conductive paste is used for mounting a semiconductor chip or the like and comprises an epoxy resin (A), a curing agent (B) and silver powder (C). The epoxy resin (A) is a bisphenol type and has a thiokol skeleton, and each end thereof is a glycidyl group. In particular, both an imidazole compound and dicyandiamide are used for the curing agent (B).
Inventors:
HARA MINORU
Application Number:
JP2000336949A
Publication Date:
May 17, 2002
Filing Date:
November 06, 2000
Export Citation:
Assignee:
TOSHIBA CHEM CORP
International Classes:
C08K3/08; C08G59/20; C08G59/60; C08L63/00; C09J9/02; C09J163/00; H01B1/22; (IPC1-7): H01B1/22; C08G59/20; C08G59/60; C08K3/08; C08L63/00; C09J9/02; C09J163/00
Attorney, Agent or Firm:
Eiji Morota