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Patent Searching and Data


Title:
CONDUCTIVE POLYMER DISPERSION AND METHOD FOR PRODUCING THE SAME, AS WELL AS METHOD FOR PRODUCING CONDUCTIVE LAMINATE
Document Type and Number:
Japanese Patent JP2022183531
Kind Code:
A
Abstract:
To provide a conductive polymer dispersion that can form a conductive layer having elasticity and a method for producing the same, as well as a method for producing a conductive laminate.SOLUTION: A conductive polymer dispersion contains a conductive complex containing a π-conjugated conductive polymer and a polyanion, water, an organic solvent, an amine compound excluding an imidazole, and a hydrophilic resin having an elongation at break of 500% or more as measured in accordance with JIS K6251. Relative to 100 pts.mass of the conductive complex, the content of the hydrophilic resin is preferably 100 pts.mass or more and 2000 pts.mass or less. The hydrophilic resin preferably contains urethane resin or vinyl versatate resin.SELECTED DRAWING: None

Inventors:
ICHIKAWA MUNEKI
MATSUBAYASHI SATOSHI
Application Number:
JP2021090893A
Publication Date:
December 13, 2022
Filing Date:
May 31, 2021
Export Citation:
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Assignee:
SHIN ETSU POLYMER CO LTD
International Classes:
C08L65/00; B05D3/12; B05D5/12; B05D7/24; B32B27/00; C08K5/17; C08L101/14; H01B1/12; H01B1/20; H01B13/00
Attorney, Agent or Firm:
Kazuzumi Nishizawa
Yuichiro Kawagoe
Shunsuke Fushimi