Title:
CONDUCTIVE RESIN PASTE
Document Type and Number:
Japanese Patent JP2678965
Kind Code:
B2
Abstract:
PURPOSE: To provide conductive resin paste for an LCD having stability in conduction, moisture resistance, heat resistance, a continuous print property, and long-term maintenance, where a cell gap can be set to 2μm or less.
CONSTITUTION: Conductive resin paste is composed of a resin mixture of a thermocurable resin including at least one kind of an epoxy resin, a phenol resin, and a mixture of an epoxy resin and an imide resin, a hardening agent, and an hardening accelerator; a solvent including ester and glycidyl ether composed of lower monobasic acid and lower first or second alcohol; and single dispersing particle silver powder having a particle diameter of 1.5μm or less. The solvent includes 5-50 parts by weight of glycidyl ether with respect to 100 parts by weight of ester. 40-140 parts by weight of the solvent is included into 100 parts by weight of the resin mixture. 150-560 parts by weight of the silver powder is included into 100 parts by weight of the resin mixture and the solvent in total.
Inventors:
Masafumi Tanaka
Kohinata Shigeru
Kohinata Shigeru
Application Number:
JP11096893A
Publication Date:
November 19, 1997
Filing Date:
April 14, 1993
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
C09J9/02; C09J11/04; G02F1/1345; H01B1/22; H05K1/09; (IPC1-7): H01B1/22; C09J9/02; G02F1/1345; H05K1/09
Domestic Patent References:
| JP4218524A | ||||
| JP62240934A |
Attorney, Agent or Firm:
Masao Yamamoto