Title:
CONDUCTIVE SILICA AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3829903
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide high conductivity and high heat resistance by sequentially forming a silicon polymer compound layer, a nickel layer, and a gold layer on a silica surface.
SOLUTION: After silica powder is treated with a silicon polymer compound having a reducing property and its surface is treated with a solution containing metal salt with a standard oxidation-reduction potential of 0.54 V or more for depositing metal colloid, electroless nickel-plating and gold-plating is applied, and consequently, conductive silica having lamination of a silicon polymer compound layer, a nickel layer, and a gold layer layered sequentially on the silica surface is provided. The conductive silica has high conductivity and high heat resistance hardly causing peeling of the plated layer in a heating process at 200°C or more. If silicone rubber and the like is blended, a conductive rubber molding with high reliability can be provided. In this way, powder exhibiting high conductivity is provided. Especially, when silica is dispersed in a reducing agent-containing aqueous solution and non-electrolytic plating is carried out in the nickel plating process during the manufacture, coagulation-free conductive silica with a four-layer structure consisting of silica, a silicon polymer compound, nickel and gold is provided.
Inventors:
Motoo Fukushima
Kunio Ito
Kunio Ito
Application Number:
JP19335499A
Publication Date:
October 04, 2006
Filing Date:
July 07, 1999
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C01B33/18; H01B1/00; B01J19/00; B22F1/02; C23C18/31; H01B1/24; (IPC1-7): H01B1/00; B01J19/00; B22F1/02; C01B33/18; C23C18/31; H01B1/24
Domestic Patent References:
| JP8311655A | ||||
| JP64062475A | ||||
| JP64089209A | ||||
| JP59117005A |
Attorney, Agent or Firm:
Takashi Kojima
Yuko Nishikawa
Yuko Nishikawa