Title:
CONDUCTIVE SILICONE RUBBER COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3950490
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive silicone rubber composition which can be cured to form a silicone rubber of excellent conductivity by mixing three specified polyorganosiloxanes with a conductive filler and two catalysts.
SOLUTION: This conductive silicone rubber composition comprises 100 pts.wt. mixture of 5-95wt.% organopolysiloxane containing at least two Si- bonded alkoxyl groups in the molecule and freed from any Si-bonded alkenyl groups and having a viscosity of 20200,000cP at 25°C with 95-5wt.% polyorganosiloxane having at least two Si-bonded alkenyl groups in the molecule, freed from any Si-bonded alkoxy groups and having a viscosity of 20-200,000cP at 25°C, an organopolysiloxane containing at least two Si-bonded hydrogen atoms in the molecule, having a viscosity of 2-20,000cP at 25°C and (used in an amount to give a molar ratio of the alkenyl groups to the hydrogen atoms of 0.5-20), 50-2,000 pts.wt. conductive filler and a catalyst component comprising a condensation catalyst and a platinum catalyst.
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Inventors:
Rikako Tazawa
Kazuki Nakayoshi
Osamu Mitani
Mine victory
Kazuki Nakayoshi
Osamu Mitani
Mine victory
Application Number:
JP21986095A
Publication Date:
August 01, 2007
Filing Date:
August 04, 1995
Export Citation:
Assignee:
DOW CORNING CORPORATION
International Classes:
C08K3/08; C08L83/07; C08L83/04; C08L83/05; C08L83/06; C09J183/00; C09J183/07; H01L21/52; H01L21/56; C09J183/05; C09J183/06; (IPC1-7): C08L83/07; C08K3/08; C08L83/05; C09J183/07; H01L21/56
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