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Title:
CONNECTION ABNORMALITY DETECTION DEVICE AND ONBOARD ELECTRONIC APPARATUS USING THIS DEVICE
Document Type and Number:
Japanese Patent JP2009264959
Kind Code:
A
Abstract:

To provide: a connection abnormality detection device that precisely measures minute changes in resistance in a solder joint regardless of variations or changes over time in electronic components and early detects a connection abnormality in the solder joint; and an onboard electronic apparatus using the device.

Voltage measuring means 108 measures the voltage of a connection point V1 between a resistivity measuring solder joint 102b and a constant-voltage supply 105 and the voltages of points V2 and V3 at both ends of a reference resistor 106. Resistance calculating means 109 calculates the resistance Rr of the resistivity measuring solder joint 102b with use of the measured voltages Vout1, Vout2 and Vout3 of the three points V1, V2 and V3. Abnormality determination means 110 determines a connection abnormality in accordance with a change in resistance Rr of the resistivity measuring solder joint 102b.


Inventors:
HAYASE KEI
Application Number:
JP2008115589A
Publication Date:
November 12, 2009
Filing Date:
April 25, 2008
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01R31/04; H01L21/60; H05K3/34
Domestic Patent References:
JPH11248766A1999-09-17
JP2007143100A2007-06-07
JP2002076187A2002-03-15
JPH01129168A1989-05-22
JPH1093297A1998-04-10
JPS63195268A1988-08-12
JPH0387672A1991-04-12
JPS62152325A1987-07-07
JPH1165616A1999-03-09
JPH05241718A1993-09-21
JPS63314473A1988-12-22
JPH04248472A1992-09-03
JPH0214075A1990-01-18
JPH04162692A1992-06-08
JP2006053052A2006-02-23
Attorney, Agent or Firm:
Masuo Oiwa
Toshihide Kodama
Takenaka Ikuo
Keigo Murakami