CONNECTION METHOD BY MOLDING METAL TERMINAL AND CIRCUIT BOARD, AND CONNECTION BODY

Japanese Patent JP2016122737

A

PROBLEM TO BE SOLVED: To provide a connection method capable of easily and surely performing a connection by molding between a terminal connection pattern that is provided on a circuit board, and a metal terminal.SOLUTION: A flexible circuit board 60 and a metal terminal 90 are accommodated within metal molds 150 and 200 and in that case, the terminal connection pattern that is provided on the flexible circuit board 60 and the metal terminal 90 are connected. The inside of a cavity C of the metal molds 150 and 200 formed in a portion including a connection part of the flexible circuit board 60 and the metal terminal 90 is filled with a molten resin and the resin is solidified, thereby molding a case in which the metal terminal 90 and the flexible circuit board 60 are connected and integrated. Within the cavity C of the metal molds 150 and 200, a molten resin flow blocking protrusion 203 is provided for blocking a flow of the molten resin in a direction away from the connection part of the metal terminal 90 and the flexible circuit board 60, and inflow of the molten resin to the cavity C around the connection part of the metal terminal 90 and the flexible circuit board 60 is promoted.SELECTED DRAWING: Figure 8

MAKINO DAISUKE
SHINOKI TAKASHI
MITSUI KOJI

JP2014262151A

July 07, 2016

December 25, 2014

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TEIKOKU TSUSHIN KOGYO KK

H01C17/28; B29C45/14; B29C45/26; B29C45/77; H01C10/38

JP2012151404A	2012-08-09
JP2007331190A	2007-12-27
JPS63169706A	1988-07-13
JPH0374801A	1991-03-29
JPS6450504A	1989-02-27
JPH01166505A	1989-06-30
JP2003288971A	2003-10-10

Yu Takagi
Takashi Kumagai

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