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Title:
CONNECTION STRUCTURE FOR OXIDE SUPERCONDUCTIVE WIRE AND CONNECTION METHOD FOR OXIDE SUPERCONDUCTIVE WIRE
Document Type and Number:
Japanese Patent JP2013037991
Kind Code:
A
Abstract:

To provide a connection structure for oxide superconductive wire which can suppress the infiltration of moisture into an oxide superconducting layer without generating a level difference in a connection part; and a connection method for oxide superconductive wire.

In a connection structure 20 of an oxide superconductive wire 10 of this invention, a superconductive lamination formed by laminating a substrate, an intermediate layer, an oxide superconducting layer and a silver layer in this order is folded into two with a solder layer held therein through a grooved part reaching the substrate from the silver layer, and at least two first oxide superconductive wires 10a in which the substrate to the silver layer in the neighborhood of an end connection 21 in one of the superconductive lamination folded into two are removed so as to expose the solder layer 12 are connected with each other by integrating mutual exposed solder layers 12.


Inventors:
SUDO YASUNORI
Application Number:
JP2011174903A
Publication Date:
February 21, 2013
Filing Date:
August 10, 2011
Export Citation:
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Assignee:
FUJIKURA LTD
International Classes:
H01R4/68; H01B12/06; H01B13/00; H01F6/06
Attorney, Agent or Firm:
Masatake Shiga
Sumio Tanai
Mitsunaga Igarashi
Toshio Komuro
Yuichiro Shimizu