PURPOSE: To connect an electronic part having electrodes arranged in a surface at narrow pitch to a wiring board highly reliably and easily as well as to enable high density mounting.

CONSTITUTION: Plural spherical contact points 33 composed of a deformable sphere are held with a resin film 31 by projecting respectively from both the surfaces, and plural inspecting pads 37 are formed in the peripheral part on one surface of the resin film 31 and are electrically connected to the respective spherical contact points 33 through external lead electrodes 38. An electronic part to be connected can be inspected by using the inspecting pads 37, and the peripheral part of the resin film 31 is cut off after the inspection. When the spherical contact points 33 are brought into pressure contact with both connecting electrodes, electrical connection is carried out.