To provide connector terminals each composed of copper or a copper alloy having a corrosion resistant finished surface free from a secular change and whose contact resistance is not increased as well by being finished in accordance with prescribed treatment working without the application of nickel substrate plating, e.g., as a copper diffusion barrier, the protection of the substrate plating and the formation of an intermediate plating layer corresponding to the pinholes of gold plating and also without requiring gold plating, and to provide a surface reforming method for connector terminals composed of copper or a copper alloy.

The surface of a comb-shaped producing member for connector terminals each composed of copper or a copper alloy is irradiated with the pulse of an electron beam having energy density at which the surface layer part is instantaneously melted by the irradiation for a short irradiation time limiting the energy quantity to the one at which the melted part is immediately resolidified for one or more times, thus a corrosion resistant-wear resistant copper amorphous layer is formed on the surface part so as to be finished. In this way, surface treatment is made needless.