Title:
CONSTRUCTION OF JOINT PART FOR PRINTED CIRCUIT BOARD, ETC., AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JPH07162119
Kind Code:
A
Abstract:
PURPOSE: To provide a construction of joint part for a printed circuit board, etc., that has a sufficient strength and can suppress an increase in production cost.
CONSTITUTION: A domed projection part 11b which is embossed independently is formed in a joint part 11a of a copper foil 11 with a specified circuit formed therein, and the inside of the part 11b is filled with an adhesive 2, so that the part 11a may facilitate proper connection with other parts by means of the part 11b.
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Inventors:
SHIKAYAMA HIDEAKI
NISHIKAWA JUNICHIRO
HASEGAWA SHINGO
NISHIKAWA JUNICHIRO
HASEGAWA SHINGO
Application Number:
JP30491793A
Publication Date:
June 23, 1995
Filing Date:
December 06, 1993
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H05K1/11; H05K3/24; H05K3/40; H05K3/38; (IPC1-7): H05K1/11; H05K3/24; H05K3/40
Attorney, Agent or Firm:
Toshiro Mitsuishi (1 person outside)
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