PURPOSE: To improve the mounting strength between a component and a substrate by enlarging inwardly lands of electrode terminals for connection on every other land provided on both sides of the component.
CONSTITUTION: A bonding area of land is increased by inwardly extending every other bonding lands of juxtaposed electrode terminals 2a, by a length of l0. With this arrangement, where there is a minor displacement of a component, the electrode terminal 2a will not project much. Extending the land of the electrode terminal, in the longitudinal direction thereof, results in an increased area of the land of the terminal, thereby leading to an improvement in the mounting strength and the stability of a bonding yield. Thus, the enhancement of the mounting strength and the stability of the bonding yield can be achieved.
SASAKI TAKAHIDE
KUMAGAI MOTOO
KATOU KUNIAKI
Next Patent: SOLDER CREAM PRINTING METHOD AND SOLDER CREAM PRINTING FORM PLATE