To provide a contact measuring method and device of an inspection probe for wiring board inspection, which can properly contact an inspection probe with an inspection point on a wiring board regardless of the presence or absence of bowing of the wiring board or the presence or absence of an oxide layer at the inspection point on the wiring board, and prevents an erroneous measurement caused by inertial force when the inspection probe makes accelerated or decelerated motion and the use of an unnecessary calculating resource.
The device for measuring the contact between the inspection point on the wiring board (2) and the inspection probe (1) has a sensor (9) which measures the magnitude of the contact pressure between the inspection probe and the inspection point. The device also has a means (8) of moving the inspection prove in a vertical direction with respect to the wiring board, a sensor which measures the contact between the inspection probe and the inspection point, and a means (15) for making the output of the sensor invalid during the accelerated or decelerated motion of the inspection probe by the moving means.
| JPH10145910 | BRANCH BOX |
| JPH0786522 | [Title of Invention] Contact data reading circuit |
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda