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Patent Searching and Data


Title:
CONTACT PROBE
Document Type and Number:
Japanese Patent JP2000171482
Kind Code:
A
Abstract:

To eliminate a difference of resistance values of pattern wirings.

Leading ends of pattern wirings 2 are arranged with a narrow pitch nearly in parallel to each other to leading end parts 1a of a contact probe 20 to form contact pins 2a. At a window part 6 of a base 1b wiring lead-out parts 2b of the pattern wirings 2 are arranged with a larger pitch than the contact pins 2a nearly in parallel to each other. The pattern wirings 2 running from the contact pins 2a to the wiring lead-out parts 2b are bent outward of the contact probe 20, so that a distance from the contact pin 2a to the wiring lead-out part 2b is larger, as the pattern wiring 2 is spaced further from a center of the contact probe 20 in a direction intersecting the pattern wiring. While a line thickness of the pattern wiring 2 is kept constant, a line breadth is formed larger at an outer side of the contact probe 20. The pattern wirings 2 are made larger in sectional area proportionally to an increase in distance from the contact pin 2a to the wiring lead-out part 2b.


Inventors:
NAKAMURA TADASHI
YOSHIDA HIDEAKI
Application Number:
JP34621498A
Publication Date:
June 23, 2000
Filing Date:
December 04, 1998
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
G01R1/073; H01L21/66; (IPC1-7): G01R1/073; H01L21/66
Attorney, Agent or Firm:
Masatake Shiga (9 outside)