To provide a contact sheet or the like capable of controlling the damage of electrodes composed of solder bumps, such as the reduction of a solder amount when electronic components such as a semiconductor chip are removed from a test substrate or the like after a test.
This contact sheet 1 composed of a porous body layer is used on the test substrate 20 or the like of a device for testing. Flip-chip bonding due to solder fusion is carried out between a connection electrode 2 embedded and arranged in the contact sheet or a substrate electrode 21 of the test substrate covered with the contact sheet and an electrode of the semiconductor chip or the like. The test of the electronic components is easily carried out by the solder joint. It is possible to control the damage of the solder bumps such as the reduction of the solder amount when the electronic components such as the semiconductor chip are removed from the contact sheet after the test. The contact sheet is effective for the repair of the electronic components such as the semiconductor chip, and the recycle of the test substrate.
AOKI HIDEO
HIRAOKA TOSHIRO
HOTTA YASUYUKI
MATAKE SHIGERU
TAKUBO TOMOAKI
| JP2000156119A | 2000-06-06 | |||
| JPH1151998A | 1999-02-26 | |||
| JPH11251368A | 1999-09-17 | |||
| JPH0613442A | 1994-01-21 | |||
| JPH06209115A | 1994-07-26 | |||
| JPS63211578A | 1988-09-02 |
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