To solve various problems resulting from foreign materials like mold dregs or solder chips which have stuck to a semiconductor package.

This container package is used to contain a semiconductor package 4 provided with the package body 5 and the lead terminal 7 extended from the package body 5. A brush 10 for removing foreign materials is provided in the lead container 8 in the state at least it contacts the front end of the lead terminal 7, in an IC tray 1 provided with a package receiver 6 on which the package body 5 is put, and the lead container 8 formed along the periphery of the package receiver 6, in the tray body 2.