To suppress the meandering of a film-shaped conductor being traveled and the resultant wrinkles or fine ruggednesses in the electroplating stage for producing a metal-coated substrate as the material for FPC and TAB tape and to provide a continuous electroplating device for producing a plated substrate excellent in appearance.

A long-sized film-shaped conductor 1 is held between a feeder roller 2 and at least one nip roller 3, and the conductor is fed from the feeder roller and continuously electroplated by this plating device. A vibrator 9 for vibrating the nip roller directly or indirectly is provided in the device. Further, a backup roller is interposed between the nip roller and vibrator to indirectly vibrate the nip roller or the nip rollers are coupled, the single backup roller is put between the coupled nip rollers, and further the length of the nip roller is made smaller than the width of the conductor.