CONTINUOUS PLATING METHOD AND CONTINUOUS PLATING DEVICE

Japanese Patent JP3440348

B2

PURPOSE: To eliminate the need for a masking jig by providing a region filled with a plating liquid in the state of maintaining contact with a metallic sheet with a meshed anode electrode, using this metallic sheet as a cathode electrode and impressing voltage between both electrodes, thereby subjecting the metallic sheet to plating.
CONSTITUTION: The prescribed amt. of the plating liquid 9 is poured in from a discharge port 1 and is made to flow out from between a lead frame sheet 10 fixed on a holding plate 5 and a cover 2. The region 3 filled with the plating liquid is formed by the lead frame sheet 10 and the cover 2. The lead frame sheet 10 is electrically connected by a metallic brush 8A to the cathode electrode 8. The voltage is impressed between the mesh 4 which is the anode electrode and the cathode electrode 8 to plate the apertures of the electrodeposition resist of the lead frame sheet 10. A flow regulating plate 7 accepts the plating liquid 9 flowing from the discharge port 1, thereby relieving the disturbance in the plating liquid 9 of the region 3 filled with the plating liquid.

Yoshinori Ota
Masami Matsumoto
Ueki Tatsuo

JP12299695A

August 25, 2003

April 25, 1995

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Dai Nippon Printing Co.,Ltd.

C25D5/02; C25D7/00; C25D7/06; C25D7/12; C25D17/00; (IPC1-7): C25D5/02; C25D7/06; C25D7/12; C25D17/00

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Satoshi Kanayama

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