Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONTINUOUS VAPOR DEPOSITION METHOD
Document Type and Number:
Japanese Patent JPS62218551
Kind Code:
A
Abstract:

PURPOSE: To permit continuous production of vapor deposited films having good quality by continuously executing vapor deposition with the same vapor source and evaporating an org. compd. which sublimates at a high temp. to coat the inside wall of a vapor deposition chamber at every end of each time of the vapor deposition.

CONSTITUTION: The vapor deposited film are formed one after another on plural substrates to be treated by using the same vapor source. The sublimatable org. compd. is evaporated by a separately provided vapor source at every end of each time of the vapor deposition in the above-mentioned continuous vapor deposition method. An org. compd. such as phthalocyanine or fluoresceine having a high sublimation temp. is adequate as the above-mentioned org. compd. The evaporated org. compd. sticks to the inside wall of the vapor deposition chamber to cover the deposits from the above-mentioned vapor source. The contamination of the substrates to be treated by the exfoliation and fall of the deposits is thereby prevented and the mass production of the vapor deposited films having good quality is made possible.


Inventors:
MAEDA MIYOZO
HASHIMOTO YASUNOBU
SUEISHI KOZO
Application Number:
JP5974786A
Publication Date:
September 25, 1987
Filing Date:
March 18, 1986
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJITSU LTD
International Classes:
C23C14/12; C23C14/56; G11B7/26; (IPC1-7): C23C14/12; C23C14/56; G11B7/26
Attorney, Agent or Firm:
Sadaichi Igita