Title:
制御装置および制御装置の保守方法
Document Type and Number:
Japanese Patent JP7072076
Kind Code:
B2
Abstract:
A control device (17) according to the present invention comprises: a semiconductor element (21); a substrate (18) on which the semiconductor element (21) is mounted; a heat sink (24) contacting an upper surface of the semiconductor element (21); a female threaded part (37) formed in the heat sink (24); an anchoring member (50) provided between the substrate (18) and a lower surface of the semiconductor element (21); a screw insertion hole (51) formed at a position, of the anchoring member (50), corresponding to the female threaded part (37); an engaging part (52) that is formed on the anchoring member (50) and engages an engaged part (32) of the semiconductor element (21); and a screw (33) that is inserted into the screw insertion hole (51) and threadingly engages the female threaded part (37).
Inventors:
Indigo heaven
Application Number:
JP2020547491A
Publication Date:
May 19, 2022
Filing Date:
September 18, 2018
Export Citation:
Assignee:
Toshiba Carrier Co., Ltd.
International Classes:
H01L23/40; H01L25/07; H01L25/18; H05K7/20
Domestic Patent References:
| JP4079440U | ||||
| JP2013089784A | ||||
| JP2009026871A | ||||
| JP2002076221A | ||||
| JP2008004869A |
Foreign References:
| WO2016162991A1 | ||||
| WO2017138341A1 |
Attorney, Agent or Firm:
Patent business corporation Tokyo International Patent Office
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