Title:
COOLING APPARATUS AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2016138740
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cooling apparatus having high cooling performance.SOLUTION: In a cooling apparatus 1 cooling by phase change of a refrigerant, a heat receiving part 3 includes a heat receiving plate to at least one of the front surface or the back surface of which a heat generation body is set, a radiation inner path 24 set on the upper part, a return inner path 25 set on the lower part and fin parts 2 set between these paths. The cooling apparatus 1 is such that: the fin part 2 includes a plurality of flat plate-like fins projecting inside from the heat receiving plate so that a refrigerant flow path between the fins makes the return inner path 25 and the radiation inner path communicate with each other; an outflow port 20 and an inflow port 21 are set to the same side surface of the heat receiving part 3; a partition plate 30 is set between the inflow port 21 and the fin part 2; and the partition plate 30 projects from the side surface to which the inflow port 21 and the outflow port 20 are set, and is extended to a position farther from the side surface to which the inflow port 21 and the outflow port 20 are set, than the intermediate point between the side surface and another side surface opposite thereto.SELECTED DRAWING: Figure 3
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Inventors:
SUGIYAMA MAKOTO
IKU SHINITSU
IKU SHINITSU
Application Number:
JP2015146703A
Publication Date:
August 04, 2016
Filing Date:
July 24, 2015
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
F28D15/02; H01L23/427; H05K7/20
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda
Hiroo Maeda