COOLING STRUCTURE FOR MOUNTING OF PRINTED-CIRCUIT BOARD

Japanese Patent JPH01132199

A

PURPOSE:To easily align a connection land of a printed-circuit board with a lead terminal of a semiconductor package, to prevent a thermal stress from being generated at the semiconductor package and the printed circuit board and to absorb a difference in thermal expansion between both by a method wherein the printedcircuit board, a contact, a guide frame and a heat-radiating sheet, which are individually specified, are provided. CONSTITUTION:The following are provided: a printed circuit board 12 where a group of connection patterns facing leads 1-1 of a semiconductor package 1 are arranged; a contact 13 installed at an insulator 13-1 so that elastic contact pieces 13-2 face said group of connection patterns; a guide frame 14 whose size is so big that the semiconductor package 1 can be inserted and where a window 14-1 equipped with a stepped part has been formed in one opening so as to be freely coupled with the contact 13; a heat-radiating sheet 15 equipped with a protrusion 15-1 which faces the window 14-1 and can be freely inserted on one face of a sheet having high thermal conductivity. The semiconductor package 1 and the contact 13 are inserted into the window 14-1 of the guide frame 14; the protrusion 15-1 of the heat-radiating sheet 15 is brought into contact with an upper face of the semiconductor package 1; the heat-radiating sheet 15, the guide frame 14 and the printedcircuit board 12 are coupled by using fastening means, 17, 18.

UTSUKA YOSHINORI

JP29163687A

May 24, 1989

November 17, 1987

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FUJITSU LTD

H01L23/40; H05K7/20; (IPC1-7): H01L23/40; H05K7/20

Sadaichi Igita

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