To improve heat dissipation characteristics by providing, between a plurality of semiconductor chips of different heights and a heat dissipation member, a heat-conductive member comprising a fin which contacts the heat dissipation member, for sure contact to a single heat dissipation member.
Semiconductor chips 1a, 1b, and 1c are jointed to the upper surface of a substrate 2 with a solder 6, and a heat-conductive member 7 is provided between the semiconductor chips 1a, 1b, and 1c and a heat dissipation member 4. Related to the heat-conductive member 7, a face facing the heat dissipation member 4 is provided with a cut, which is set up to form a fine fin 8. The fine fin 8, in bowed state, always contacts a surface of the heat dissipation member 4. Thus, when the semiconductor chips 1a, 1b, and 1c generate heat, it is transferred to a solder 10 and the heat-conductive member 7, and then to the heat dissipation member 4, so a low thermal resistance is realize. Since the heat-conductive member 7 is filled with a grease 9, still lower thermal resistance is realized.
OKADA RYOJI
TAGUCHI KEIJI
NAKAJIMA TADAKATSU
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