To provide a high thermal conductivity characteristic for a high- performance heat sink by cladding a first layer of oxygen-free copper on an oxygen-rich second layer, and directly bonding a ceramic base board to the second layer.

A first layer 11 of oxygen-free copper is combined to a layer 12 of oxygen-rich copper to form a laminating body 10. In short, in manufacture process, a first layer 11 is, firstly, cladded on a second layer 12 at a relatively low speed. The laminating body 10 is, in order to improve tolerance in its thickness and width, processed with finish-rolling and slitting, and a groove 14 is formed at a selected position of the laminating body 10. Then, out of the laminating body 10, a plurality of ribbons are eventually cut, and tension- leveled for linearzing and flattening. Then the laminating body 10 is stamped to such part comprising a selected shape 6. Lastly, the laminating body 10 is washed and bonded to a base board 15 for the first layer 11 to be baked to the second layer 12.