Title:
Copper alloy board material, a manufacturing method for the same, and an energized part article
Document Type and Number:
Japanese Patent JP6140032
Kind Code:
B2
Abstract:
[Problem] Provides is a Cu-Fe-P-Mg-based copper alloy sheet material that is excellent in terms of electrical conductivity, strength, bending workability, and stress relaxation resistance in the case where load stress is applied in TD. [Means for Resolution] The copper alloy sheet material contains, in mass%, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, and P: 0.01 to 0.20%, and the contents of these elements satisfy the relation Mg - 1.18 (P - Fe/3.6) ¥ 0.03. The Mg solid-solution ratio determined by the amount of dissolved Mg (mass%) /the Mg content of the alloy (mass%) × 100 is 50% or more. The density of an Fe-P-based compound having a particle size of 50 nm or more is 10.00 particles/10 µm 2 or less, and the density of an Mg-P-based compound having a particle size of 100 nm or more is 10.00 particles/10 µm 2 or less.
Inventors:
Kunio Miyagi
Sufumi Kan
Tomoaki Aoyama
Hiroto Narie
Hideki Endo
Akira Sugawara
Sufumi Kan
Tomoaki Aoyama
Hiroto Narie
Hideki Endo
Akira Sugawara
Application Number:
JP2013180162A
Publication Date:
May 31, 2017
Filing Date:
August 30, 2013
Export Citation:
Assignee:
DOWA Metal Tech Co., Ltd.
International Classes:
C22C9/00; B21B3/00; C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22C9/10; C22F1/08; H01B1/02; H01B5/02; H01B13/00
Domestic Patent References:
| JP2007291518A | ||||
| JP2009275286A | ||||
| JP200739793A | ||||
| JP2006200036A | ||||
| JP2007177274A | ||||
| JP2001131657A | ||||
| JP63111151A | ||||
| JP6092439A | ||||
| JP201031339A | ||||
| JP2012167310A |
Foreign References:
| WO2010071220A1 |
Attorney, Agent or Firm:
Komatsu Taka
Kenji Wada
Kenji Wada