Title:
COPPER ALLOY FOIL FOR HIGH FREQUENCY CIRCUIT
Document Type and Number:
Japanese Patent JP3765718
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To develop a copper alloy foil having high strength and low impedance while retaining high electroconductivity of copper.
SOLUTION: The copper alloy foil for a high frequency circuit includes 1%-4.8% Ni, 0.2%-1.4% Si, and copper and inevitable impurities as the balance, based on a mass percentage (%) (hereafter referred to as %), and has a maximum height (hereafter referred to as Ry) of 0.3 μm-3.5 μm and an arithmetic mean roughness (hereafter referred to as Ra) of 0.02 μm-0.2 μm, as a surface roughness, and high tensile strength of 650 N/mm2 or more.
Inventors:
Naohiko Era
Yasuo Tomioka
Yasuo Tomioka
Application Number:
JP2000288991A
Publication Date:
April 12, 2006
Filing Date:
September 22, 2000
Export Citation:
Assignee:
Nikko Metal Processing Co., Ltd.
International Classes:
B42D15/10; C22C9/06; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10; (IPC1-7): C22C9/06; B42D15/10; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10
Domestic Patent References:
| JP11264040A | ||||
| JP2170937A |