COPPER ALLOY AND METHOD FOR PRODUCING THE SAME

Title:

COPPER ALLOY AND METHOD FOR PRODUCING THE SAME

Document Type and Number:

Japanese Patent JP2010242154

Kind Code:

A

Abstract:

To provide a copper alloy excellent in both of strength and conductivity, specifically, having tensile strength exceeding 900N/mm2and the conductivity of 20%IACS or more, and a method for producing the same.

The copper alloy contains Ni of 3.3 mass% or more and 8.4 mass% or less, and Si of 0.6 mass% or more and 2.1 mass% or less, and the remainder is constituted of Cu and inevitable impurities, mass ratio (Ni/Si) of Ni and Si is 4.0 or more and 5.5 or less, and the size of an inclusion to be deposited in the copper alloy is 10 μm or less.

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Inventors:

ITO TAKEFUMI
KAWAMATA SUSUMU
KAWABATA TOSHIKAZU
IWASHITA YUMIKO
KURITA TOSHIHIRO

Application Number:

JP2009091470A

Publication Date:

October 28, 2010

Filing Date:

April 03, 2009

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP
MITSUBISHI ELECTRIC METECS CO LTD

International Classes:

C22C9/06; C22F1/08; H01B1/02; C22F1/00

Domestic Patent References:

JPH0310036A	1991-01-17
JP2006249516A	2006-09-21
JP2006283107A	2006-10-19
JP2005089843A	2005-04-07
JP2004156115A	2004-06-03
JP2006152392A	2006-06-15
JP2006249516A	2006-09-21

Attorney, Agent or Firm:

Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Kazuhiro Oyaku
Shunichi Ueda

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