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Title:
COPPER ALLOY AND COPPER ALLOY PLASTIC PROCESSING MATERIAL
Document Type and Number:
Japanese Patent JP2013104101
Kind Code:
A
Abstract:

To provide a copper alloy which is high in rigidity and has excellent processability, and a copper alloy plastic processing material composed of the copper alloy.

The copper alloy contains Mg in a range of 3.3 atom% or higher and 6.9 atom% or lower, its remaining part is substantially composed of Cu and inevitable impurities, an oxygen amount is 500 atom ppm or lower, and when a content of Mg is set to be X atom%, conductivity σ (%IACS) is set within a range of σ≤1.7241/(-0.0347×X2+0.6569×X+1.7)×100. Also in scanning electron microscope observation, an average number of inter-metal compounds with Cu and Mg which are not smaller than 0.1 μm in particle diameter as main components is set not to be larger than 1 piece/μm2. Furthermore, the copper alloy may contain at least one kind or two or more kinds of Al, Ni, Si, Mn, Li, Ti, Fe, Co, Cr and Zr within a range of 0.01 atom% or higher and 3.0 atom% or lower in total.


Inventors:
MAKI KAZUMASA
ITO YUKI
Application Number:
JP2011248731A
Publication Date:
May 30, 2013
Filing Date:
November 14, 2011
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
C22C9/00; C22F1/08; C22F1/00
Domestic Patent References:
JP2013100571A2013-05-23
JP2011241412A2011-12-01
JP2013100571A2013-05-23
JP2011241412A2011-12-01
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Hiroshi Masui
Fumihiro Hosokawa