Title:
電気電子部品用銅合金板材
Document Type and Number:
Japanese Patent JP4974193
Kind Code:
B2
Abstract:
A copper alloy material for electric/electronic components according to the present invention is characterized in that a average grain size of 1 to 50 µm that is designated by ((a+b)/2) in which a thickness of a grain is defined to be (a) and a width thereof is defined to be (b) which is on a cross section that is vertical to a rolling direction, an aspect ratio (a/b) thereof is between 0.5 and 1.0, an aspect ratio (a/b) of a grain before performing a bend working and an aspect ratio (a' /b') of which a grain is effected by a tensile stress after performing a bend working of 90 degrees satisfy the following (Formula 1) of: 2 ¤ a + b / a¹ / b¹ ¤ 15
and the copper alloy material has a bending workability to be excellent.
Inventors:
Kuniteru Mihara
Yohei Kaneko
Kiyoji Hirose
Yohei Kaneko
Kiyoji Hirose
Application Number:
JP2009552547A
Publication Date:
July 11, 2012
Filing Date:
February 06, 2009
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C22C9/06; C22C9/00; C22C9/02; C22C9/04; C22C9/10; C22F1/08; H01B1/02; C22F1/00
Domestic Patent References:
| JP2006009108A | 2006-01-12 | |||
| JP2006219733A | 2006-08-24 | |||
| JPH0920943A | 1997-01-21 | |||
| JP2008024999A | 2008-02-07 | |||
| JP2008056977A | 2008-03-13 | |||
| JP4006467B1 | 2007-11-14 |
Foreign References:
| WO2006101172A1 | 2006-09-28 |
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae
Naosuke Miyamae