To produce a PCB male terminal excellent in Pb-free solderability and having sufficient strength and electric conductivity from a copper alloy plate on both sides of which Sn is plated before blanking.

The copper alloy plate with Sn plating for PCB male terminals for producing the PCB male terminals has Sn plated layers on both surfaces and has shear-cut end faces by press blanking on both end faces. The copper alloy contains 0.05-2.6 mass% Fe, 0.01-0.2 mass% P, and one or two of 0.01-5 mass% Zn and 0.01-2 mass% Ni, and the balance Cu with inevitable impurities. Alternatively, the copper alloy contains 0.01-2 mass% Ni, 0.01-0.2 mass% P, and the balance Cu with inevitable impurities.