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Patent Searching and Data


Title:
COPPER ALLOY WIRE WITH HIGH ELECTRIC CONDUCTIVITY AND HIGH BENDABILITY
Document Type and Number:
Japanese Patent JP2000144484
Kind Code:
A
Abstract:

To provide a copper alloy wire having high electric conductivity and high bendability and suitably used for a conductor for robot driving cable, and its manufacturing method.

At the time of manufacturing a high conductivity and high bendability copper alloy wire composed of an in-situ formed chromium fiber reinforced copper or copper-alloy matrix composite and obtained by forming in-situ a chromium layer fiber in a copper or copper-alloy matrix, the surface of the wire is tin plated in a stage after the completion of required heat treatment and then heavy plastic working is applied to modify the plating layer.


Inventors:
TAKAHARA HIDEFUSA
KOBAYASHI SHIGERU
Application Number:
JP32022798A
Publication Date:
May 26, 2000
Filing Date:
November 11, 1998
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO
YOSHINOKAWA ELECTRIC WIRE & CA
International Classes:
H01B13/00; C22C47/02; C22C47/08; C22C49/00; C22F1/00; C22F1/08; C25D5/48; C25D7/06; (IPC1-7): C25D5/48; C22C47/02; C22C47/08; C22C49/00; C22F1/08; C25D7/06; H01B13/00
Attorney, Agent or Firm:
Toshiro Mitsuishi (1 person outside)