Title:
COPPER ALLOY
Document Type and Number:
Japanese Patent JP2012177152
Kind Code:
A
Abstract:
To provide a copper alloy having good conductivity, high strength, excellent bendability, and excellent stress relaxation resistance.
The copper alloy includes 1.5 to 3.6% Ni, 0.3 to 1.0% Si, and the remainder consisting of copper with unavoidable impurities. The average crystal grain size of the crystal grains of the copper alloy is 5 μm to 30 μm. The area ratio of the crystal grains having crystal grain sizes of not less than twice the average crystal grain size is 3% or more, and the area ratio of cube orientation grains in the area of the crystal grains having crystal grain sizes of not less than twice the average crystal grain size is 50% or more.
Inventors:
SHISHIDO HISAO
KATSURA SHINYA
ARIGA YASUHIRO
MATSUMOTO KATSUSHI
KATSURA SHINYA
ARIGA YASUHIRO
MATSUMOTO KATSUSHI
Application Number:
JP2011040393A
Publication Date:
September 13, 2012
Filing Date:
February 25, 2011
Export Citation:
Assignee:
KOBE STEEL LTD
International Classes:
C22C9/06; C22C9/01; C22C9/02; C22C9/04; C22C9/05; H01B1/02; C22F1/00; C22F1/08
Domestic Patent References:
| JP2010275622A | 2010-12-09 | |||
| JP2008196042A | 2008-08-28 | |||
| JP2005298931A | 2005-10-27 |
Foreign References:
| WO2009060873A1 | 2009-05-14 | |||
| WO2007138956A1 | 2007-12-06 |
Attorney, Agent or Firm:
Takenaka Yoshimichi
Seiji Kameoka
Hironori Takenaka
Toru Sakatani
Yoshiyuki Kaji
Makoto Suhara
Seiji Kameoka
Hironori Takenaka
Toru Sakatani
Yoshiyuki Kaji
Makoto Suhara
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