To provide a film deposition device capable of inhibiting the temperature difference in the substrate and of alleviating the stress generated on the substrate, and to provide a method for producing a film deposition substrate.

In the film deposition device, the substrate is reciprocated while heating or cooling the substrate by normally and reversely switching the rotation of a freely rotatable conveying roller for conveying the substrate by contact therewith. Thereby, the position of a contact point of the substrate with the conveying roller is changed, and a specific region is prevented from only contacting the conveying roller, thereby inhibit generation of temperature difference in the substrate. Further, heating/cooling of the substrate can be performed without expanding the setting area of a heating/cooling unit by reciprocating the substrate. Furthermore, since the substrate is heated or cooled while rotating the conveying roller, the friction coefficient of the substrate with the roller can be reduced, the contact point of the substrate with the roller is heaved, and thus stretch and compression of the substrate become permissible.