To provide a copper-electroplating bath that hardly causes formation of voids or seams at plating so as to enable filling of a small-diameter through-hole with copper by a copper-electroplating method, enables cost reduction by reducing the number of steps compared to conventional methods, realizes simplified steps by enabling filling of copper into a through-hole using a direct current instead of a reverse current and enables plating and filling of a through-hole with a copper film that is excellent in heat radiation compared to a conventional through-hole filling paste etc.
The copper-electroplating bath comprises (A) a sulfur compound, (B) a polyalkylene glycol compound containing at least 4 ether bonds, (C) an azo compound, (D) copper sulfate pentahydrate, (E) sulfuric acid and (F) chloride ion.
OMURA NAOYUKI
| JP2001073182A | 2001-03-21 | |||
| JP2007138265A | 2007-06-07 | |||
| JP2003013277A | 2003-01-15 | |||
| JPH07157890A | 1995-06-20 | |||
| JP2001200386A | 2001-07-24 | |||
| JP2005333153A | 2005-12-02 |
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa