COPPER ELECTROPLATING METHOD AND METALLIZED RESIN FILM HAVING COPPER PLATING FILM DEPOSITED USING COPPER ELECTROPLATING METHOD

Title:

COPPER ELECTROPLATING METHOD AND METALLIZED RESIN FILM HAVING COPPER PLATING FILM DEPOSITED USING COPPER ELECTROPLATING METHOD

Document Type and Number:

Japanese Patent JP2013019037

Kind Code:

A

Abstract:

To provide a copper electroplating method for forming a copper plating film showing improved processability to a fine pattern wiring, and a metallized resin film obtained by using the copper electroplating method for depositing the copper plating film.

In the copper electroplating method for forming the copper plating film by applying electric current to a copper plating solution, copper plating is carried out while adjusting the current density of the electric current applied to the copper plating solution to ≤0.5 A/dm² until thickness of the copper plating film reaches 2.5 μm, wherein the copper plating solution contains 8-30 wt.ppm organic compound including sulfur atom as a constituent atom.

Inventors:

TAKENOUCHI HIROSHI
SONE HIROBUMI
KOGAMI MASASHI
SHIMAMURA TOMIO
HATA HIROKI

Application Number:

JP2011155191A

Publication Date:

January 31, 2013

Filing Date:

July 13, 2011

Export Citation:

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Assignee:

SUMITOMO METAL MINING CO

International Classes:

C25D3/38; C23C28/02; C25D5/00; C25D5/10; C25D7/00; C25D7/06

Domestic Patent References:

JP2010222651A	2010-10-07
JPS55125125A	1980-09-26
JP2004190073A	2004-07-08
JP2005256159A	2005-09-22
JP2005166910A	2005-06-23

Foreign References:

WO2010110259A1

2010-09-30

Attorney, Agent or Firm:

Yoshitaka Oshida

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