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Title:
COPPER ELECTROPLATING METHOD USING INSOLUBLE ANODE
Document Type and Number:
Japanese Patent JP2007169700
Kind Code:
A
Abstract:

To provide a copper electroplating method using an insoluble anode by which a non-penetrated hole on a material to be plated, such as the inside of a blind via hole of a substrate material for a build-up printed wiring board is filled stably for a long period.

In the copper electroplating method using the insoluble anode, the dissolved oxygen in a copper electroplating bath is kept to ≤30 mg/L.


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Inventors:
KANAI TOSHINOBU
SEKI YASUAKI
YOKOHATA TAKASHI
MATSUNAMI TAKUJI
Application Number:
JP2005367643A
Publication Date:
July 05, 2007
Filing Date:
December 21, 2005
Export Citation:
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Assignee:
VICTOR COMPANY OF JAPAN
OKUNO CHEM IND CO
ALMEX INC
International Classes:
C25D7/00; C25D3/38; C25D17/10; C25D21/10; C25D21/12
Domestic Patent References:
JP2003183879A2003-07-03
JP2001267726A2001-09-28
JP2002226993A2002-08-14
JPH01297884A1989-11-30
JPH0273689A1990-03-13
JP2002161391A2002-06-04
JP2003133698A2003-05-09
JP2002173793A2002-06-21
JPH11220257A1999-08-10
Foreign References:
WO2001068952A12001-09-20
Attorney, Agent or Firm:
Eiji Saegusa
Kakehi Yuro
Jun Fujii



 
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