ETCHING LIQUID OF COPPER AND COPPER ALLOY

Title:

ETCHING LIQUID OF COPPER AND COPPER ALLOY

Document Type and Number:

Japanese Patent JP2016204679

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide an etching liquid for etching copper or copper alloy making a surface of the copper or the copper alloy rough and enhancing adhesiveness with a resin by blending a specific additive with the etching liquid.SOLUTION: 2-aminoimidazole as an additive is blended with an etching liquid consisting of hydrogen peroxide and an inorganic acid.SELECTED DRAWING: None

More Like This:

JP2009235438	ETCHING LIQUID, ETCHING METHOD USING THE SAME, AND SUBSTRATE TO BE ETCHED
WO/2011/147448	COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS

Inventors:

KATSUMURA MASATO
FUJIKAWA KAZUYUKI

Application Number:

JP2015083749A

Publication Date:

December 08, 2016

Filing Date:

April 15, 2015

Export Citation:

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Assignee:

SHIKOKU CHEM

International Classes:

C23F1/18; H05K3/06

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