Title:
METHOD FOR MANUFACTURING SOLDER PLATING COPPER WIRE, APPARATUS FOR MANUFACTURING SOLDER PLATING COPPER WIRE, AND SOLDER PLATING COPPER WIRE OBTAINED BY APPARATUS AND METHOD FOR MANUFACTURING SOLDER PLATING COPPER WIRE
Document Type and Number:
Japanese Patent JP2016204680
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing a solder plating copper wire, capable of manufacturing the solder plating copper wire having a high production efficiency and reducing a yield strength of 0.2% while obtaining adhesion between a copper wire and a solder plated layer.SOLUTION: The method for manufacturing a solder plating copper wire including a solder plated layer on the surface of a copper wire comprise: the step of dipping the copper wire heated at a temperature of 650-1020°C by resistance heating caused by energization or induction heating just before being dipped into a molten solder bath, for 0.7- 4.0 seconds into the molten solder bath having a temperature of 230-330°C; and the solder plating step of pulling up the copper wire from the molten solder bath. In a temperature control range in the vicinity of the copper wire pulled into the molten solder bath, the temperature of the solder bath is 230-440°C.SELECTED DRAWING: Figure 1
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Inventors:
SETO YOSHIKI
SAKAMOTO DAIKI
ISSHIKI NOBUMOTO
SAKAMOTO DAIKI
ISSHIKI NOBUMOTO
Application Number:
JP2015083925A
Publication Date:
December 08, 2016
Filing Date:
April 16, 2015
Export Citation:
Assignee:
NETUREN CO LTD
International Classes:
C23C2/38; B23K1/00; B23K1/08; B23K31/02; C21D9/56; C22F1/08; C23C2/08
Domestic Patent References:
| JP2013077612A | 2013-04-25 | |||
| JP2013102054A | 2013-05-23 | |||
| JPH01502915A | 1989-10-05 |
Foreign References:
| WO2012111185A1 | 2012-08-23 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura
Hiroko Negishi
Kayo Ono
Hiroko Negishi
Kayo Ono