To provide a copper foil for a printed circuit board which has excellent adhesive properties to an insulating substrate and excellent etching properties, and is excellent in manufacturing efficiency.

The copper foil for the printed circuit board includes a copper foil base and a coating layer covering at least a part of a copper foil base surface. The coating layer includes an iron alloy layer principally containing Fe and Ni and/or Cr, and a Cr layer stacked in order from the copper foil base surface. The coating layer contains 18 to 200 μg/dm2 of Cr in total and 15 to 400 μg/dm2 of Fe and Ni in total in terms of sticking amount.