Title:
ETCHING PROTECTIVE MATERIAL
Document Type and Number:
Japanese Patent JP2010258400
Kind Code:
A
Abstract:
To provide, by an easy and inexpensive method, an etching protective material having all of excellent durability against an etchant (alkali and acid), heat resistance in processing, excellent adhesiveness to a wafer subjected to an etching treatment, and removability after the etching treatment; and to provide a method of manufacturing a device substrate using the same.
In the etching protective material formed of a film made by forming a layer containing a polyolefin resin on a surface part of at least one surface of a polyolefin film, the polyolefin resin contains an olefin constituent (A) comprising 2-4C alkene as a main constituent, and containing 2-40 mass% of a (meta)acrylic acid ester constituent (B).
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Inventors:
YAMADA MUNENORI
SHIBA YOSHITO
YOSHINO TAKEMASA
SHIBA YOSHITO
YOSHINO TAKEMASA
Application Number:
JP2009166827A
Publication Date:
November 11, 2010
Filing Date:
July 15, 2009
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
H01L21/306
Domestic Patent References:
| JP2006282738A | 2006-10-19 | |||
| JP2006193690A | 2006-07-27 | |||
| JPH07207237A | 1995-08-08 | |||
| JP2010132835A | 2010-06-17 |
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