Title:
COPPER FOIL WITH CARRIER, AND PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND COPPER-CLAD LAMINATE WITH USE OF THE SAME
Document Type and Number:
Japanese Patent JP2014141061
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil with carrier, which can sufficiently prevent the occurrence of blistering in an FPC due to the residue of gas or vapor generated by heating or the like.SOLUTION: A copper foil with carrier includes a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultra-thin copper layer laminated on the intermediate layer. The ultra-thin copper layer has pinholes with a diameter of 1 μm or more and 50 μm or less, at 1 piece/cmor more and 3000 pieces/cmor less.
Inventors:
SAKAGUCHI KAZUHIKO
Application Number:
JP2013117394A
Publication Date:
August 07, 2014
Filing Date:
June 03, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
B32B15/04; H05K1/09
Attorney, Agent or Firm:
Axis International Patent Business Corporation
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