Title:
COPPER FOIL WITH A CARRIER, PRINTED WIRING BOARD, COPPER-CLAD LAMINATE, ELECTRONIC APPARATUS AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2014208909
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil with a carrier that allows good laser holing of ultra-thin copper layer and is suitable in the preparation of high density integrated circuit board.SOLUTION: A copper foil with a carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, characterized in that when the copper foil with a carrier is heated at 220°C for 2 hours, followed by peeling off the ultra-thin copper layer in accordance with JIS C6471, the surface roughness Rz on the intermediate layer side of the ultra-thin copper layer measured by a laser microscope is 0.62 μm or more and 1.59 μm or less and the standard deviation of the surface roughness Rz is 0.51 μm or less.
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Inventors:
KOHIKI MICHIYA
Application Number:
JP2014073927A
Publication Date:
November 06, 2014
Filing Date:
March 31, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D1/04; C25D7/06; H05K1/09; H05K3/20
Attorney, Agent or Firm:
Axis international patent business corporation