COPPER POWDER FOR CONDUCTIVE PASTE AND METHOD FOR PRODUCING THE SAME

Title:

COPPER POWDER FOR CONDUCTIVE PASTE AND METHOD FOR PRODUCING THE SAME

Document Type and Number:

Japanese Patent JP2016145404

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide copper powder for conductive paste having high oxidation resistance and high conductivity, and a method for producing the copper powder for conductive paste.SOLUTION: The present invention provides copper powder for conductive paste in which a surface oxygen concentration per unit surface area is 0.15(mass%/g/m) or less, and an oxygen concentration increment per unit surface area under an atmosphere and after a heat resistance test for 24 hours at 100°C is 0.60(mass%/g/m) or less.SELECTED DRAWING: Figure 1

More Like This:

JP6175304	A manufacturing method of a circuit board using the copper paste and this containing a copper composite particle and this
JPS60223102	MANUFACTURE OF MAGNETIC POWDER
JPH0297603	SILICON IRON ALLOY POWDER AND MANUFACTURE THEREOF AND COMPACTING CORE

Inventors:

KANESHIRO MASAKI
INOUE KENICHI
SUGIYAMA AKIO

Application Number:

JP2015023703A

Publication Date:

August 12, 2016

Filing Date:

February 09, 2015

Export Citation:

Click for automatic bibliography generation Help

Assignee:

DOWA ELECTRONICS MATERIALS CO

International Classes:

B22F1/00; B22F1/02; H01B5/00; H01B13/00

Domestic Patent References:

JP2008013837A

2008-01-24

Foreign References:

WO2012157704A1

2012-11-22

Attorney, Agent or Firm:

Aniya Setsuo
Okuyama Tomohiro

Previous Patent: MIXED PARTICLE, SLURRY CONTAINING MIXED PARTICLE, COMPOSITE AND CONJUGATE

Next Patent: REFINING METHOD FOR MOLTEN IRON, AND METHOD OF AND DEVICE FOR ANALYZING COMPOSITION OF HIGH-TEMPERAT...