Title:
CORRECTING METHOD FOR PHOTORESIST PATTERN
Document Type and Number:
Japanese Patent JPS5656635
Kind Code:
A
Abstract:
PURPOSE:To shorten a correcting process for resist pattern sharply by sticking a charged etching resisting matter when a cut is detected on the pattern. CONSTITUTION:A notch on a wafer 17 is contacted to a plane of a notch detecting jig 14 by means of said jig 14, a fixed jig 15 and a control system 16, which is scanned for judgement on availability as compared with an original pattern. When a cut is found on a coordinate (a, b) in a resist pattern on the wafer, electromagnet plates 21-24 are actuated 20 to recognize the coordinate and the cut, and a needle electrode 25 is controlled positionally to the coordinate (a, b) from behind the wafer. On the top of the wafer, an electrode 28 under a spot coating device 26 for etching resisting matter which works as a nozzle at the same time is controlled positionally to the coordinate (a, b) by control systems 20, 27. High voltage is applied on the electrodes 28, 25 through the control system 20, thereby sticking a charged particle 29 of the etching resisting matter to the cut. Where a short circuit is detected on the coordinate (c, d) the nose of a device 31 for laser beam or the like is introduced to the coordinate (c, d) in the same way, thus etching the short circuit.
Inventors:
OGURA MOTOTSUGU
Application Number:
JP13460979A
Publication Date:
May 18, 1981
Filing Date:
October 15, 1979
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G03F1/00; G03F1/72; H01L21/027; H01L21/30; (IPC1-7): H01L21/30