Title:
CORRECTING PROCESS OF WIRE BONDING POSITION
Document Type and Number:
Japanese Patent JPS59161042
Kind Code:
A
Abstract:
PURPOSE:To secure wire bonding precision by a method wherein the connecting status of wire connection to a bonding pad is detected to correct a bonding position. CONSTITUTION:Bonding status is detected by means of arresting a bonding pad by an optical process and in terms of optical intensity distribution. When a pressure fixed ball 1 is shifted by (l) from the center of a bonding pad 2, the result of detected bonding pad 2 comprises a light bonding pad (region indicated by 1) and a dark region (region indicated by 0) made by a gold pressure fixed ball 1. An approximate center 0 of the pressure fixed ball 1 is located by means of drawing a perpendicular in X, Y direction passing a point where 0 changes into 1. When the pressure fixed ball 1 is shifted exceeding the precision allowance, correct the original position to locate the wire bonding position conforming to the new reference.
Inventors:
TANIMOTO MICHIO
YAMAZAKI ISAMU
TANIGUCHI YUUZOU
YAMAZAKI ISAMU
TANIGUCHI YUUZOU
Application Number:
JP3022484A
Publication Date:
September 11, 1984
Filing Date:
February 22, 1984
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/603; H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Katsuo Ogawa