Title:
CHIP COIL
Document Type and Number:
Japanese Patent JP3242206
Kind Code:
B2
Abstract:
PURPOSE: To obtain the title chip coil having no solder protrusion on flange parts by a method wherein an outer electrode is provided with a notch for reducing the solder amount bonded onto the outer electrode by the notch amount.
CONSTITUTION: A molten solder is bonded onto an outer common electrode 6 and outer input-output electrodes 7, 8. Next, a core 1 is pressurized in one direction so that any surplus molten solder may be released from the outer common electrode 6 and the outer input-output electrodes 7, 8 to form a solder coating film in proper thickness on the surfaces of said electrodes 6, 7, 8. Especially, the amount of the molten solder bonded onto the outer common electrode 6 may be reduced by the amount of a notch 9. Accordingly, the surplus solder is hardly bonded onto the outer common electrode 6 and the bonded solder if any can be easily released by the notch 9 thereby enabling the possibility of making a solder bump on the outer common electrode 6 of the end faces 3b, 3c to be precluded.
Inventors:
Takahiro Azuma
Hiromichi Tokuda
Toshiki Kaneko
Hiromichi Tokuda
Toshiki Kaneko
Application Number:
JP13421293A
Publication Date:
December 25, 2001
Filing Date:
June 04, 1993
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01F27/29; H01F17/04; (IPC1-7): H01F27/29; H01F17/04
Attorney, Agent or Firm:
Takekazu Morishita