Title:
COUPLING STRUCTURE OF LAMINATED WAVEGUIDE LINES
Document Type and Number:
Japanese Patent JP3464104
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide coupling structure between the laminated waveguide line and a microstrip line, between the laminated waveguide line and a coplaner line or between the laminated waveguide lines that is easily manufactured by a known multi-layer processing technology.
SOLUTION: The coupling structure is a structure to couple a laminated waveguide line 10 provided with a couple of main conductors 2, 3 formed in parallel with a dielectric materil inbetween and two rows of via-hole groups 4 placed at an interval between a cut-off wavelength or below to connect electrically the main conductor layers 2, 3 electrically in a signal transmission direction with other signal transmission line 5 such as a microstrip line, a coplaner line or a laminated waveguide line, a transmission via-hole 6 is extended from an end of the other signal transmission line 5, the other end of the transmission viahole 6 is inserted to the laminated waveguide line 10 and the transmission via-hole is acted as a monopole antenna.
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Inventors:
Hiroshi Uchimura
Ken Takenoshita
Ken Takenoshita
Application Number:
JP29042596A
Publication Date:
November 05, 2003
Filing Date:
October 31, 1996
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01P3/00; H01P3/12; H01P5/08; H01P5/107; (IPC1-7): H01P5/107; H01P3/12
Domestic Patent References:
| JP377402A | ||||
| JP653711A | ||||
| JP5042769A |