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Title:
CRIMPED-STATE INSPECTION APPARATUS OF SUBSTRATE
Document Type and Number:
Japanese Patent JP2008091843
Kind Code:
A
Abstract:

To provide a crimped-state inspection apparatus for accurately inspecting the crimped state of the terminal electrode of a flexible substrate that is crimped to the terminal electrode of a control board through an anisotropic conductive film.

In a crimped-state inspection apparatus for inspecting the crimped state of the terminal electrode of a flexible substrate that is crimped to the terminal electrode of a control board through an anisotropic conductive film, there provided are coaxial downwardly lighting 13 for radiating parallel light 16 from the upper part of the flexible substrate 2; an imaging means for imaging the deformed state of the terminal electrode 17 caused by pressing conductive particles 19 in the anisotropic conductive film to the terminal electrode 17 that is formed on the back face of the flexible substrate 2 at the time of crimping from the surface through the flexible substrate 2; and an image processing section for image-processing the image data of the terminal electrode 17 of the imaged flexible substrate 2. The quality judgement of the crimped state is performed by comparing the deformed-state data of the terminal electrode 17 of the flexible substrate 2 in a judgement frame 32 provided in the processed image data with the preset quality judgement data.


Inventors:
OKUDA TAKASHI
MORIKAWA MEGUMI
SHINTANI YOSHIHIDE
SAKURAMOTO HIROSHI
Application Number:
JP2006299616A
Publication Date:
April 17, 2008
Filing Date:
October 04, 2006
Export Citation:
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Assignee:
TAKATORI CORP
International Classes:
H01L21/60; H05K3/36